15.225 k k recommended torque 1.0 in lbs (16 in oz) 8.17 4.01 2.50 1.60 l section k-k detail l scale 16 : 1 top view sg15-bga direct mount, solderless socket for test applications features: ? directly mounts to target pcb (needs tooling holes) with hardware. ? over 40ghz bandwidth @-1db ? low and stable contact resistance for reliable production yield. ? self inductance under 0.025nh. ? compression plate distributes forces evenly ? easily removable swivel socket lid ?2015 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: sg15-bga 7x7mm 0.4mm pitch 16x16 array primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/17/15 material: material finish: weight: 5.53 SG15-BGA-1002 drawing scale: 4:1 sheet: 1 of 4 eng: v. panavala file: SG15-BGA-1002 drawn by: v. panavala
1.7 0.1 (x4) non plated hole 0.85 (x2) non plated hole 2.54 5.08 * 3.4375 3.3625 12.725 0.050 15.2250.125 socket base outline 1.2500.125 (x4) 1.2500.125 (x4) 6.00 6.00 2.925 3.075 3.00 0.40 0.2500 ( xpad) a1 corner note: full bga pattern shown. please adjust pattern according to individual requirements. note: bga pattern is not symmetrical with respect to the mounting holes, it is offset 0.075mm target pcb recommendations total thickness: 1.6mm min. plating: enipig, solder finish, hard gold pcb pad height: same or 0.001"-0.002" lower than solder mask is acceptable solder mask opening: 0.013" tolerances: hole diameters 0.0254mm [0.001"], pitches (from true position) 0.0762mm [0.003"], substrate thickness tolerance 10%, all other tolerances 0.127mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: recommended pcb layout primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/17/15 material: material finish: weight: 5.53 SG15-BGA-1002 drawing scale: 6:1 sheet: 2 of 4 eng: v. panavala file: SG15-BGA-1002 drawn by: v. panavala ?2015 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com
d e 0.07 g 6.00 6.00 b a1 corner 0.15 x y 0.05 a a1 detail g scale 16 : 1 0.1 z ironwood package code: bga256a 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m-1994. 3. dimension b is measured at the maximum solder ball diameter, parallel to datum plane z. 4. datum z (seating plane) is defined by the spherical crowns of the solder balls. 5. parallelism measurement shall exclude any effect of mark on top surface of package. dim minimum maximum a 0.9 2.0 a1 0.14 0.24 b 0.30 d 7.0 bsc e 7.0 bsc e 0.4 bsc array 16x16 pin count 256 tolerances: hole diameters 0.0254mm [0.001"], pitches (from true position) 0.0762mm [0.003"], substrate thickness tolerance 10%, all other tolerances 0.127mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: compatible bga primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/17/15 material: material finish: weight: 5.53 SG15-BGA-1002 drawing scale: 8:1 sheet: 3 of 4 eng: v. panavala file: SG15-BGA-1002 drawn by: v. panavala ?2015 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com
8 3 1 5 2 6 4 11 10 12 7 9 14 13 14 16 4.00 (x4) 2.00 90 (x4) 4x 1.1913 thru all 0-80 unf thru all backing plate specification 2.5 1.00 item no. description material 1 socket lid 7075-t6 aluminum alloy 2 compression plate 9.95 x 1.5mm 7075-t6 aluminum alloy 3 compression screw m6x1 stainless steel (18-8) 4 #0-80 x .25 lg, soc hd cap screw, alloy stl, blk oxide alloy steel 5 #0-80 shoulder screw, 0.062" thread length stainless steel (303) 6 ghz socket base 10mm ic 3mm thk 7075-t6 aluminum alloy 7 ball guide kapton polyimide/cirlex 8 pcb 7x7mm 0.4mm pitch 16x16 array fr4 9 elastomer guide for 10mm ic 0.15mm kapton polyimide/cirlex 10 alignment pin 1/32" dia. x 1/8" lng chrome stainless steel 11 test chip material 12 ic guide 7mm ic torlon 4203 13 insulating washer, 4mm od. kapton polyimide/cirlex 14 10x10mm 5 post backing plate 7075-t6 aluminum alloy 15 insulating disk, 2mm od with 2 mil thk adesive kapton polyimide/cirlex 16 0.15mm thick, 0.05x 0.05mm pitch, 10mm sqr, z-axis conductive angled elastomer 20 micron dia gold plated brass filaments arranged symettrically in a silicon rubber (63.5 degree angle) tolerances: hole diameters 0.0254mm [0.001"], pitches (from true position) 0.0762mm [0.003"], substrate thickness tolerance 10%, all other tolerances 0.127mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: socket specification primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/17/15 material: material finish: weight: 5.53 SG15-BGA-1002 drawing scale: 4:1 sheet: 4 of 4 eng: v. panavala file: SG15-BGA-1002 drawn by: v. panavala ?2015 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com
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